doc. no : qw0905-LEG35162-PF-0808 rev. : a date : 05 - sep. - 2008 data sheet ligitek electronics co.,ltd. property of ligitek only bipolar type led lamps LEG35162-PF lead-free parts pb
25.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 60 -60 50% 100%75% 0 25%25% 75% 50%100% -30 0 30 2.54typ 1.0min 0.5 typ 1 2 1 2 package dimensions part no. LEG35162-PF page 1/6 7.01 1.76 1.5max e g 1.7 3.95 ligitek electronics co.,ltd. property of ligitek only
-40 ~ +100 tstg storage temperature forward voltage @10ma(v) spectral halfwidth nm luminous intensity @10ma(mcd) part nomaterial peak wave length pnm viewing angle 2 1/2 (deg) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. 635 565 gap green gaasp/gap LEG35162-PF white diffused orange emittedlens 1.7 302.14.58.050 1.7 453.0 2.1 min.typ.min. 50 5.0 typ. typical electrical & optical characteristics (ta=25 ) color page 2/6 part no. LEG35162-PF forward current i f ma 15 15 reverse current @5v operating temperature t opr ir peak forward current duty 1/10@10khz power dissipationpd i fp -40 ~ +85 1010 a 5050 5080 ma mw ratings absolute maximum ratings at ta=25 parameter symbol green orange unit ligitek electronics co.,ltd. property of ligitek only
3/6 page e chip 750 700 650 1.0 0.5 0.0 600 550 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature LEG35162-PF part no.
ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a typical electro-optical characteristics curve r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 600 550650 0.5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.5 relative intensity vs. wavelength 1.0 ambient temperature( ) fig.3 forward voltage vs. temperature f o r w a r d c u r r e n t ( m a ) forward voltage(v) fig.1 forward current vs. forward voltage g chip ambient temperature( ) fig.4 relative intensity vs. temperature 4/6 page forward current(ma) fig.2 relative intensity vs. forward current LEG35162-PF part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 5/6 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max 60 seconds max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. LEG35162-PF part no.
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 6/6 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. LEG35162-PF part no.
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